Leonis: Ka Band Chipset Overview
Arralis Leonis plug and play Ka band chipset. Unlock advanced capacity for mass consumer applications of on the go satellite communications.
This first of its kind Ka band chipset comprises all of the circuits required to build a K band satellite and ground front end that will connect easily with high power amplifiers and antennas. Ka band is considered the next big thing for satellite technology with its smaller antennas and ground terminals, as well as dramatically lowered costs.
The Leonis chipset was developed to meet the needs of the growing demand for low cost Ka band satellite equipment that is simple to interface with current digital internet hardware. Applications include 5G communications, airborne high speed Wi-Fi, low earth orbit mega constellation communications, drone constellations and SAT-Drone-Ground data networks, satellite to automotive connectivity, connected vehicles, last mile and remote internet solutions, and IoT and M2M communications.
The chips are available as individual die or as QFN packaged ‘core chips’. In the latter case, only four devices are needed to make a complete transmitter/ receiver whether for space or ground applications. The diagram below explains the setup:
The example above shows a typical set-up for a downlink where the transmit frequency is in the 17-21GHz band and the receive frequency is in the 27-31GHz band. Filtering and high power amplifiers are not shown for clarity. A single phase-locked VCO is included that provides the local oscillator feed for both up and downconversion.
The devices have direct IQ inputs and outputs so are ideal for high data rate complex modulation techniques such as QAM. Additional modulators and multiplexers are readily available and can be easily interfaced.
We developed this chipset based on the requirments and feedback of you, our customers. We are always seeking to build and improve our offering so please talk to us about your future needs.Yulung Tang, MMIC Designer